摘要
基板白边角是层压板、覆铜板及多层印制电路板生产中比较常见的产品缺陷.产品热压成型时流胶偏多与"欠压"是其产生主因,控制半固化片技术指标及设计合适层压菜单是解决问题的关键.
WHITE EDGES/CORNERS IS A COMMON DEFECT IN PRODUCTION OF G 10/FR4 UNCLAD/COPPERCLAD LAMINATE AND MULTILAYER BOARDS. THE ＂OVER FLOW＂ OF RESIN AND ＂UNDER PRESSURE＂ DURING PRESSING ARE THE MAIN CAUSES. TO CONTROL PREPREG PROPERTIES AND SET-UP ADEQUATE PRESSING MANUAL IS THE KEY TO SOLVE THIS PROBLEM.
出处
《覆铜板资讯》
2006年第2期17-24,16,共9页
Copper Clad Laminate Information
关键词
层压板
覆铜板基板
基板白边角
G10/FR4 LAMINATE, COPPERCLAD LAMINATE, WHITE EDGES/CORNERS
