电解退镀法退除金银镀层废件中的金和银

Electrolytic Stripping Process for Withdrawing Gold and Silver from Cheap Scraps Plating Gold and Silver

应用电解退镀法退除金银复镀层、金镀层银和镀层废件中金和银。结果表明,浓硫酸—脂肪醇体系中,最佳退镀条件为电解电压8V,脂肪醇添加量15g/L_(H_2SO_4),搅拌后退镀液呈紊流态,Re为2880。退镀后金主要存在于固相沉淀物中,其含量在93％以上;而银存在于固相沉淀物和溶液中,它在两相中的分配比依不同镀层种类而异。

Electrolytic stripping process for withdrawing gold and silver from cheap scraps plating gold and silver has been conducted. The results showed that in electrolytic bath filled with concentrated H2SO4-glycerine system, the best stripping conditions were as follows: the electrolytic voltage was 8V, amount of glycerine added 15g/LH,so., the Re of electrolytic solution 2880. After electrolytic stripping process, the gold mainly existed in precipitate, and its content was over 93%; the silver accumulated in precipitate or solution, and its distributive ratio was different with kinds of eating.