SPC技术在大功率半导体器件生产中的应用

Application of SPC in High Power Semiconductor Device Production

为提高功率半导体器件生产的可靠性和成品率,监控工艺生产过程,将质量控制融会到关键生产工序过程中,采用了统计过程控制(SPC)技术来分析工艺参数;介绍了SPC技术所包括的工艺受控判据,技术流程,控制图,工序能力分析等要素,并以磷扩散工艺为例,阐明了该技术在大功率半导体器件生产中的应用,得出工序能力指数为1.81,工艺参数偏差小,设计中心值与实际分布中心值重合,以及该工序能力很强等结果。

Statistical Process Control （SPC） techniques are introduced to analyze process parameters in order to improve device reliability and yield,control process production and penetrate quality control into critical production process in this paptr.The SPC techniques consist of judgment rule,technique flow,control chart and process capability analysis aredetailed.Taken POCL3 diffusion for example,how SPC techniques work in high power semiconductor device process is shown.It is calculated that process capability index is 1.81 ,deviation is slight and practical distribution mean value is centered on the target mean value.It is concluded that the process ability is very strong.