摘要
文章介绍了无铅焊料研究的趋势及Sn-Zn系焊料研究取得的最新进展,分析了Sn-Zn系焊料与Sn-Ag系焊料研究的差距。最后,文章还总结了Sn-Zn系焊料研究面临的困难,找出了存在于基础研究和应用研究领域的若干问题,指出Sn-Zn系焊料的研究还需要更加深入。
The investigating trend of lead-free solders and the latest development on Sn-Zn were introduced in present paper. Problems on Sn-Zn Lead-free solders were point out by comparing them with Sn-Ag solders. These problems involved in fundamental material research and applied technology study.
出处
《电子与封装》
2006年第4期10-14,共5页
Electronics & Packaging
关键词
无铅焊料
润湿性
抗氧化性
抗腐蚀性
Lead-free solders
Wettability
Oxidation resistance
Corrosion resistance
