无铅封装认证

Certification of Lead-free in Electronic Packaging

电子产品向无铅化转变是大势所趋。但电子产品无铅焊料的回流温度比有铅焊料高40℃左右,这会导致产品的金属间化合物生长加速和潮气等级降低。在实现从有铅到无铅的转变前,需要对相关的材料进行认证,以保证产品能够满足用户需要。文章主要讨论了无铅封装材料的认证问题。

The conversion to lead free is the trend in electronic packaging technology. However, the reflow temperature will increase about 40℃ by using lead free materials which will lead to the growth of interm etallics and the degradation of resistance to moisture. So, carefull certification of lead-free materials need be carried before the transition period.