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MOEMS器件技术与封装 被引量:2

MOEMS Devices Technology and Packaging
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摘要 微光电子机械系统(MOEMS)已经在业界受到研究人员和相关人士的极大关注。文章介绍了MOEMS器件,主要就其制作工艺和封装技术做了讨论。其中,文章着重详细介绍了微光电子机械系统器件的封装工艺和相关技术。 Micro- optical -electro-mechanical-system ( MOEMS ) have received a great of interest and attention from research labs and from the industry. This paper proposes MOEMS devices, make process and packaging technology. And the packaging technology is introduced completely.
出处 《电子与封装》 2006年第4期18-22,17,共6页 Electronics & Packaging
关键词 MOEMS 封装 PCB EOCB 光互连 MOEMS Packaging PCB EOCB Optical Interconnects
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参考文献5

  • 1Karl-Heinz Brenner.Development of modules for micro optical integration and MOEMS packaging[].Proceedings of SPIE the International Society for Optical Engineering.2001
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同被引文献46

  • 1雷红涛.微光机电系统在军事和民用领域的应用与展望[J].中国航天,2004(12):27-29. 被引量:4
  • 2孙东明,董玮,郭文滨,刘彩霞,王国东,徐宝琨,陈维友.MOEMS光开关动力学过程分析[J].Journal of Semiconductors,2005,26(7):1448-1453. 被引量:2
  • 3史春红.直列式点火系统及其许用装药[J].火工品,1997(1):48-52. 被引量:5
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