覆铜箔板纸的技术进展

Technical Development of Printed Circuit Board Paper

介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。分析了覆铜箔板纸的性能与覆铜箔板性能的关系,总结了玻璃纤维覆铜箔板纸和纺纶纤维覆铜箔板纸的技术概况。提出了造纸行业要加强与其他行业的协作,在原料、制造工艺方面不断革新,开发出满足覆铜箔板行业发展需要的新产品。

The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper. The relationship between the paper and the printed board and the status of R＆D of the paper are discussed in detail. The technical performance of glass fiber made paper and aromatic fiber made one is presented. The cooperation between the paper industry and the related ones to promote the innovation in raw material, manufacturing process is suggested in this paper. The new product will be developed constantly to meet the printed board requirement.