超细钨丝的电解腐蚀制备及其性能表征

Fabrication and characterization of ultra-fine tungsten wire

直径小于7μm的超细钨丝是制备Z-pinch丝阵负载的主要原料,为了满足Z-pinch物理实验需要,利用电解腐蚀法原理,制备出了直径最小为3.0μm的超细钨丝。研究了电解液温度、电解液质量分数、电解电压和收丝速度等工艺条件对钨丝的影响,并用扫描电镜、原子力显微镜和万能测力计测试了所制备钨丝的直径、形貌及抗拉强度。实验表明,电解电压和收丝速度是影响钨丝腐蚀速度的主要因素,所制备的钨丝表面光滑,均方根粗糙度为2.42 nm,直径为3.5μm的钨丝其抗拉强度为2.32 g。利用这种方法所制备的超细钨丝已用作Z-pinch丝阵负载的靶材料,取得了很好的物理实验结果,X光能量已达到36.58 kJ。

An electrolysis corrosion method was used in producing ultra-fine tungsten wires with diameters less than 7μm. The main factors that influence the tangsten wire were investigated, including the temperatures, KOH mass fraction of the electrolytic solution, electrolytic potentials and coiling velocity on the tungsten wires. The results show that the electrolytic potential and coiling velocity are the most important factors. The morphologies, roughness and strengths of the as-produced ultra-fine wires were characterized by Scanning Electronic Microscopy （SEM）, Atomic Force Microscopy （AFM） and Tension/Compression Tester. Compared with the initial wires, the as-fabricated ultra-fine tungsten wires, 3.5 ttm in diameter, with a surface extraction roughness of 2.42 nm and a tensile strength of 2.32 g, have smoother surfaces and lower strengths. And the developed techniques have been successfully used to produce ultra-fine wires with a diameter down to 3.0 μm. Furthermore, the as-produced tungsten wires meet the requirement of Z-pinch wire array loads for physical experiments.