3M.Kohtoku,T.Kominato,Y.Nasu and T.Shibata.New Waveguide Fabrication Techniques for Next-generation PLCs[J].NTT Technical Review,2005,3(7):37-41.
4Bo Yang,Jian Duan .Effects of adhesive on coupling efficiency of components in planar light waveguide packaging.American Journal of Nanotechnology,2010,1 (2):68-77.
5MARCUSE D.Loss analysis of single-mode fiber splices[J].Bell System Technical Journal,1976,56(5):703-719.