摘要
综述了目前无铅焊接工艺回流焊和波峰焊的工艺特点,指出了焊接中存在的几大主要失效问题,包括开裂、焊点空洞、晶须和板材胀裂,并介绍了避免或减弱这些失效问题的方法。
The characteristics of the lead-free jointing technology and the main causes of its failures were summarized, include lift-off, solderpoint voids and Sn whisker etc. Also some methods to avoid or lower these failures were given.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2006年第5期69-72,共4页
Electronic Components And Materials
基金
国家863计划引导项目(2002AA001013)
关键词
电子技术
无铅焊料
工艺
失效
开裂
焊点空洞
晶须
electronic technology
lead-free solder
technology
failure
lift-off
solderpoint voids
Sn whisker
