摘要
无铅化是国际电子整机业发展的必然趋势,无铅制程的导入给企业带来新的挑战与机遇。针对无铅化电子组装带来的问题给出了相应的解决方案,其中包括无铅化生产实施步骤、物料与设备的选择、工艺的制定、有毒有害物质的检测及运行成本等。
Lead-free is the trend of international electronics assembly, and lead-free process induces many new problems. This article gives solutions to problems including implement process, choice of equipments and materials and setup of parameters, along with inspection and test of productions for elements with toxin, cost of run as well.
出处
《电子工业专用设备》
2006年第5期46-55,共10页
Equipment for Electronic Products Manufacturing
关键词
无铅钎料
波峰焊
再流焊
浸焊
手工焊
Lead-free Solder
Wave Soldering
Reflow Soldering
Dipping Soldering
Handing Soldering
