竹材表面胶合性能

Bonding Properties of Bamboo Surface

该文主要研究竹材表面胶合性能,重点探讨了竹材的热压压力、施胶量、竹龄、组坯方式、竹材的不同处理方式等因子对竹材胶合性能的影响,用电子扫描镜观察竹材胶层分布情况.研究结果表明：热压压力、施胶量、竹坯的组合方式对竹材的胶合强度有显著影响;未经处理的竹材表面的胶合性能优于高温和硼酸处理;竹材胶层的微观观察结果表明：在相同压力下,1度竹的胶层与竹材之间的有较大的缝隙存在,胶合面平整度低;其他龄竹竹材的胶层均未发现较大的缝隙,并且胶层表面相对平整,胶层在竹材表面最薄处只有10 μm,最厚处在40～50 μm之间;在15 kg·cm^-2和20 kg·cm^-2的压力下,基本上未见到胶层与竹材之间的缝隙,压力变化对胶层厚度没有显著影响,一般胶层厚度小于10 μm.

This paper mainly studied the bonding properties of bamboo surface. It focused on discussing the effects of the hot-press pressure, gluing spread, bamboo age, assemble methods and treatments on the bonding properties of bamboo. The distribution of glue layer was observed by SEM. The results showed that pressure, glue spread, ages, assemble methods had notable effects. Bonding properties of bamboo treated by high temperature and boracic acid were lower than that of the controls. The glue layer observed by SEM showed that fissure was existed in glue layer of 1-year bamboo and that the surface of glue was not smooth. The fissure was not found at other age classes. The thickness of glue layer was about 10- 50 /μm. The fissure was not found under pressure of 15 kg/cm^2 and 20kg/cm^2. Pressure had no significant effects on the thickness of glue layer. Usually, The thickness of glue layer was less than 10/μm .