电子镇流器局部热点分析

The Analysis on High Temperature Point in Electronic Ballast

电子镇流器工作过程中,其内部器件的发热引起的温升过高是导致镇流器损坏的主要原因之一.本文通过对电子镇流器基本结构进行介绍,在不同的温度环境中主要器件发热情况进行实验测试,并进行理论分析,给出了相应的解决方案.

The major factor that causes the damage of electronic ballast is the high temperature due to the heat generated by the circuit components. This paper introduced electronic ballasts and the circuit topology. Then, the testing results of the performance of several major components in different temperature were presented. Finally, related theoretical analysis and solutions were given.