期刊文献+

微槽群相变式微冷系统的换热特性实验 被引量:3

An Experimental Investigation of Heat Transfer Performance on a Micro-Grooves Phase Change Micro-Cooling System
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摘要 对用于大功率电子器件冷却的微槽群相变微冷系统的冷却工质液位高度、蒸发元件表面微槽群尺寸及横向微槽的采用等因素对整个微冷系统散热性能的影响进行了实验研究.在其他条件保持不变的情况下,对液位高度变化、微槽群尺寸及横向微槽的采用对微冷系统散热影响进行了讨论,并确定了该微冷系统的最佳液位参数和最佳尺寸参数. This paper described an experimental investigation on heat transfer performance of a micro-grooves phase change micro-cooling system for heat dissipation of high power electronic apparatus. The effects of the distance from the reservoir surface of the cooling medium to the center of the heated zone, the size of grooves and the adoption of transverse grooves were discussed. The optimal distance from the reservoir surface of the cooling medium to the center of the heated zone and the optimal size of micro rectangular capillary grooves were obtained.
出处 《中国科学院研究生院学报》 CAS CSCD 2006年第3期313-316,共4页 Journal of the Graduate School of the Chinese Academy of Sciences
关键词 微冷系统 微尺度传热 微槽群蒸发元件 相变换热 micro-cooling system, micro-scale heat transfer, micro-grooved evaporator, phase change heat transfer
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参考文献6

  • 1Nakayama W.Forced convective/conductive conjugate heat transfer in microelectronic equipment.Annual Review of Heat Transfer,1997,8:1 ~ 48
  • 2Hetsroni G,et al.A uniform temperature heat sink for cooling of electronic devices.Inter.J.Heat Mass Transfer,2002,45:3275 ~ 3286
  • 3Qu W,Mudawar I.Flow boiling heat transfer in two-phase micro-channel heat sinks-I.Experimental investigation and assessment of correlation methods.Inter.J.Heat Mass Transfer,2003,46:2755 ~ 2771
  • 4Zhao YH,Hu XG,Tsuruta T,et al.Phase-change heat transfer in micro-capillary grooves.J.Enhanced Heat Transfer,2004,11 (4):315 ~ 324
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同被引文献7

  • 1胡学功,颜晓虹,赵耀华.微槽群蒸发器在电子芯片冷却方面的应用[J].化工学报,2005,56(3):412-416. 被引量:17
  • 2S Belhardj, S Mimouni, A Saidane, et al. Using Microchannels to Cool Microprocessors: a Transmission- Line-Matrix Study. Microelectronics Journal, 2003, (34): 247-253.
  • 3Nakayama W. Forced Convective/Conductive Conjugate Heat Transfer in Microelectronic Equipment. Annual Review of Heat Transfer, 1997, 8:1-48.
  • 4Hesroni G, A Mosyak, Z Segal, et al. A Uniform Temperature Heat Sink for Cooling of Electronic Devices. Inter. J . Heat Mass Transfer, 2002, 45:3275-3286.
  • 5Hu Xuegong, Zhao Yaohua, Yan Xiaohong. A Novel Micro Cooling System for Electronic Devices Using a Micro Capillary Groove Evaporator. Journal of Enhanced Heat Transfer, 2004, 11(4): 407-415.
  • 6谢德仁.电子设备热设计工作点评[J].电子机械工程,1999,15(1):26-28. 被引量:22
  • 7孙思睿,张杰,倪明玖.横向磁场下侧壁加热方腔熔化的数值模拟研究[J].力学学报,2022,54(9):2377-2386. 被引量:2

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