电子集成块封装工艺及传递模设计

Design of transfer mould and encapsulation technique for integrated circuit package

介绍了电子集成块的封装工艺,针对电子集成线路封装要求,提出了传递模结构设计的要点,尤其对大型封装传递模的流道设计、注入压头结构、型腔设计和预防小岛移动等提出新的要求,以提高电子集成块的封装质量。

The encapsulation technique of integrated circuit package was introduced. lhe key points in designing the structure of transfer mould were put forward according to the requirement for integrated circuit package. A new suggestion was made on the structural design of transfer mould for large scale package in terms of the sprue, injection pressure head, runner and cavity, etc in order to increase the encapsulation quality of IC package.