摘要
介绍了电子集成块的封装工艺,针对电子集成线路封装要求,提出了传递模结构设计的要点,尤其对大型封装传递模的流道设计、注入压头结构、型腔设计和预防小岛移动等提出新的要求,以提高电子集成块的封装质量。
The encapsulation technique of integrated circuit package was introduced. lhe key points in designing the structure of transfer mould were put forward according to the requirement for integrated circuit package. A new suggestion was made on the structural design of transfer mould for large scale package in terms of the sprue, injection pressure head, runner and cavity, etc in order to increase the encapsulation quality of IC package.
出处
《模具工业》
北大核心
2006年第5期55-57,共3页
Die & Mould Industry
基金
广西壮族自治区自然科学基金项目(桂科自0481009)资助
关键词
IC封装
工艺
传递模设计
IC package
technique
design of transfer mould