摘要
介绍了一种新型的铜面化学前处理方法——超粗化前处理工艺,该工艺用于阻焊油墨前处理,可解决沉锡和化学镀镍/浸金板绿油剥离的问题。
The paper introduces a new type of pretreatment process, with which we create a super-roughened copper surface. This process specifically suits for solder mask （SM） pretreatment process of PCB. With the application of Supper Roughening Process, Solder mask peeling after Immersion Tin and ENIG will be avoidable.
出处
《印制电路信息》
2006年第5期37-39,共3页
Printed Circuit Information
关键词
前处理
超粗化
阻焊剥离
沉锡
化学镀镍/浸金
pretreatment
supper roughening
sold mask peeling
immersion tin
ENIG
