化学镀铜的物理化学

Physical chemistry of the electroless copper

实验确定了化学镀铜的最佳工艺与配方,研究了化学镀铜的热力学及动力学机理.结果表明:从热力学数据分析看,还原剂的电极电位皆比铜离子负,用甲醛、次亚磷酸钠做还原剂还原Cu2+在热力学上是可行的,在碱性溶液中对化学镀铜反应有利;从阴极极化曲线的Tafel斜率分析看,Cu2+=Cu+步骤为阴极反应的速度控制环节;从镀液的旋转圆盘电极测试结果分析看,电子跃迁步骤H2C(OH)O-ad rdsHCOOH+1/2H2+e-为镀液中阳极反应速度的控制性步骤.

The experiment confirms the best craft and dispensation of the electroless copper. The thermodynamics and the dynamics mechanism have been studied. The results show that it is advisable for the HCHO and NaH2PO2 as the reduction due to the electrode potential of the reduction is more negative than that of Cu^2＋ from the analysis of data in thermodynamics. It is advantage for the reaction of electroless copper in the alkaline solution. According to the analysis of Tafel slope of a cathodal polarization curve, the step of Cu^2＋ = Cu^＋ is the beneficial factor for the rate of cathodal reaction. The electron transition H2C（OH）O^-1→ad rds HCOOH＋1/2H2＋3^-is the controlled step of the rate of anode reaction, which isfrom the results of analysis of the test of the rotary-disk electrode.