圆片级封装的凸点制作技术

Wafer Bumping Technology for WLP

圆片级封装是一种先进的电子封装技术,近年来,圆片级封装技术的发展速度很快,主要应用于系统级芯片、光电器件和MEMS等。凸点制作是圆片级封装工艺的关键工序,目前凸点制作工艺方法有多种,重点介绍常用的电镀法、植球法和蒸发沉积法凸点工艺,分别介绍这三种凸点制作技术的工艺流程、关键技术。

WLP is an advanced technology in the electronic packaging. Over the last few years, WLP has developed rapidly. It is applied in SOC, FPA and MEMS so on. Wafer bumping is a key working procedure of WLP. Now there are various wafer bumping process. Introduce electroplating of bump, solder sphere placement, and evaporation indium processes that they are current technique of wafer bumping, including process procedure and key technology.