恒电位极化诱发钨铜合金化学镀镍磷的研究

Study on Electroless Ni-P Plating on W-Cu Alloy Induced by Potentiostatic Polarization

使用自行研制的镀液配方,研究了在钨铜合金基体上化学镀镍磷的可行性。试验通过恒电位极化诱发法在N iSO4-H2PO2-体系中实现了钨铜合金表面的化学镀镍磷。对极化过程中基材表面的化学镀诱发机理进行了探讨,通过筛选试验确定了外加恒电位的大小和极化时间,并对镀层形貌和质量进行了检测。结果表明,镀层具有较好的结合力和耐蚀性。因此在钨铜合金上进行化学镀镍磷时,恒电位极化法是一种较好的诱发方法。

The process of electroless Ni-P plating on W-Cu alloy in NiSO_4-H_2PO^-_2system induced by potentiostatic polarization was studied.The desired polarized potential and duration were determined based on screening test.Moreover,the morphology and surface quality of the target Ni-P alloy coating were analyzed as well.It was found that potentiostatic polarization could be readily used to facilitate the electroless plating of Ni-P on W-Cu alloy,and the target Ni-P coating had good adhesion to the substrate and good corrosion resistance as well.