期刊文献+

影响微粒复合沉积的诸因素 被引量:11

Factors Affecting the Codeposition of Particulates in Complex Electroplating
下载PDF
导出
摘要 复合镀层中固体微粒的含量决定其硬度、耐腐蚀、抗磨等性能,而影响微粒与基质金属复合沉积的因素很多,如电流密度、微粒表面电荷、温度、pH值、搅拌方式等。介绍了影响复合电镀微粒共沉积的各种因素,分析了诸因素在复合镀层形成过程中所起的具体作用,探讨了微粒与基质金属共沉积的机理。概述了纳米微粒解团聚的方法,指出了今后复合电镀的研究方向。 A review was given on the factors affecting the codeposition of particulates in composite electroplating.Thus the actions of various factors in the electroplating process were analyzed, the codeposition mechanisms of the particulates and the metallic matrix were discussed,and the methods to get rid of agglomeration of nano-sized particulates in the plating bath were summarized.It was pointed out that the content of the particulates in the electroplated coatings has significant effects on the hardness,corrosion resistance and wear resistance of the composite coatings,while the co-deposition of the particulates and metallic matrix is dependent on many factors such as current density,the surface charge of the particulates,temperature,pH value,and the agitation mode.Meanwhile,a prospect was provided concerning the development trend of composite electroplating.
出处 《材料保护》 CAS CSCD 北大核心 2006年第5期35-39,共5页 Materials Protection
基金 国家自然科学基金资助项目(50474055 50234020)
关键词 复合电镀 纳米微粒 共沉积 composite electroplating nano-sized particulates codeposition affecting factor
  • 相关文献

参考文献35

  • 1吴以南 徐惠光.分散电镀[J].电镀与环保,1984,4(4):28-28.
  • 2Hovestad A, Janssen L J J. Electrochemical codcposition of inert particles in a metallic matrix [ J ].Journal of Applied Electrochemistry, 1995, 25 (6) :519 - 527.
  • 3Snaith D W, Groves P D. A study of the mechanisms of cermet electrodeposition [ J ]. Transactions of the Institute of Metal Finishing,1972, 50(3):95 - 101.
  • 4Snaith D W, Groves P D. Some further studies of the mechanism of cermet electrodeposition: Part 1-The effect of electrolyte on the charge carried by a suspended ceramic particle[ J]. Transactions of the Institute of Metal Finishing, 1977, 55 (3) : 136 - 140.
  • 5Snaith D W, Groves P D. Some further studies of the mechanism of cermet electrodeposition: Part 2-Variable factors in the process of electrodeposition of metal - matrix composites [ J ]. Transactions of the Institute of Metal Finishing,1978, 56( 1 ) :9 - 14.
  • 6Tomaszewski T W, Tomaszewski L C, Brown H. Composition of finely dispered particles with metals [ J ].Plating, 1969, 56( 11 ) : 1234 - 1239.
  • 7White C, Foster J. A study of particle-cathode adhesion during the formation of electrodeposited composite coatings [ J ]. Transactions of the Institute of Metal Finishing, 1978, 56(2) :92 - 96.
  • 8White C, Foster J. Factors affecting the entrapment of alumina particles during the electrodeposition of copper[ J ]. Transactions of the Institute of Metal Finishing,1981, 59(1) :8 - 12.
  • 9Foster J, Kariapper A M J. A study of the mechanisms of formation of electrodeposited composite coatings [ J ].Transactions of the Institute of Metal Finishing, 1973,51(1) :27-31.
  • 10胡信国.电沉积Cr-SiC高耐磨复合镀层的研究[J].电镀与环保,1987,7(1):7-9.

二级参考文献65

共引文献173

同被引文献91

引证文献11

二级引证文献23

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部