尿素熔体中Cu－Ti合金电沉积研究

Electrodeposition of Cu-Ti in Urea Melt

采用循环伏安曲线、恒电位电解断电后的电位－时间曲线以及ＥＤＡＸ等方法，研究了Ｃｕ（Ⅱ）、Ｔｉ（Ⅳ）在尿素－金属溴化物熔体中还原的电极过程，探讨了Ｃｕ—Ｔｉ合金电沉积的条件和机理。结果表明，在尿素－金属溴化物熔体中，Ｃｕ（Ⅱ）一步不可逆还原为Ｃｕ，Ｔｉ（Ⅳ）被还原，并与Ｃｕ（Ⅱ）共沉积为Ｃｕ—Ｔｉ合金，所得Ｃｕ—Ｔｉ合金中含钛量可达４９ａｔ％。

Electro-reduction of Cu(Ⅱ), Ti (Ⅳ) in urea-metal bromide melt is studied by means of cyclic voltammetry, current-time curve at potential step, open circuit potential -time curve after constant-potential electrolysis and EDAX. Mechanism and condition of Cu-Ti electrolytic co-deposition are also discussed. Experimental results show that electro-reduction of Cu (Ⅱ) to Cu irreversible in one step. Ti (Ⅳ) is reduced and co-deposited with Cu resulting in a Ti content of 49 at% in Cu-Ti alloy obtained.