摘要
本文主要介绍了在微电子表面组装技术(SMT)中应用的自动光学检测(AOI)技术与系统的基本概况,讨论了无铅化对AOI的影响,并对SMT组装质量的AOI技术发展趋势进行了分析。
This paper mainly introduces the general situation of automatic optics inspection technology and system which are applied in surface mounting technology of micro-electronics, discusses the impact of the lead-free solder on AOI, analysis the developmental current of automatic optics inspection technology applied in surface mounting technology assembling.
出处
《电子质量》
2006年第5期17-19,共3页
Electronics Quality
