摘要
本文采用扫描电子显微镜分析了MLCC电极的微观结构,发现并研究了其存在的问题:端电极银底层存在较多的空洞及针孔缺陷,银底层与镍层之间结合不紧密等。这些电极微观结构反应出的问题,是降低MLCC可靠性和增加废品率的重要原因。研究结果对于生产工艺及配方的改进有着重要的实用意义。
In this paper,the microstructure of the electrode of MLCCs was investigated by scanning electron microscopy (SEM). The experimental results show that microstructure of the electrode exist following problems:For the shrinkage rate of the silver-palladium inner electrode paste film be different to that of a dielectric green sheet, lamination engendered between inner electrode and ceramic dielectric in the MLCCs et aI.These phenomenas plays an important role in the final quality of MLCCs.The analysis outcomes in this paper is great hold-up for improving the yield and quality of MLCCs.
出处
《电子质量》
2006年第5期34-35,共2页
Electronics Quality
关键词
多层陶瓷电容器
电极
附着力
可靠性
Multiplayer ceramic capacitor
Electrode
Adhesion
Reliability