摘要
本文介绍了表面贴装产品生产的工艺流程。提出了相应的质量控制程序和技术要求。探讨了发生失效的各种原因,给出了如何在工艺上进行改进以改善焊点的可靠性,提高产品质量的措施。
This paper introduced the technics of the SMT manufacturing. The procedure and some technical criteria of SaT quality control are mentioned briefly.Whose causes are studied. How to improve joint＇s quality and reliability is also studied.
出处
《电子质量》
2006年第5期36-38,共3页
Electronics Quality
