摘要
文章从高功率半导体激光器光纤耦合模块的组成和各个部分的机理出发,详细分析了影响其可靠性的因素,主要有以下三个方面:激光器自身的因素、耦合封装工艺和电学因素。通过优化原有工艺与采用新技术,提高了模块的可靠性,拓宽了其应用领域。
Through analyzing constitute and mechanism of high power laser diode （LD） fiber coupling module, the effects on reliability of LD fiber coupling module are detailed as following： crafts of coupling and encapsulation, electricity factors and LD itself. After optimizing correlative crafts and adopting new technology, we have improved its reliability and broaden its application domain.
出处
《激光与红外》
CAS
CSCD
北大核心
2006年第5期358-360,共3页
Laser & Infrared
