摘要
研究了脉冲电场作用对纯铜再结晶温度的影响,并对纯铜的显微组织、硬度-温度曲线进行了研究。结果表明:经电脉冲处理的纯铜再结晶过程向高温区推移,使纯铜的热稳定性、耐热性能得到了改善。
The recrystallizing temperatures were investigated by imposing an electric pulse field on pure copper,and the microstructures of pure copper after electric pulse modification, the hardness-temperature curve were also studied. The results show that the recrystallizing temperature of pure copper are raised to a higher temperature range, which improves the thermal stability and bearing resistance to high temperature.
出处
《热加工工艺》
CSCD
北大核心
2006年第10期4-6,共3页
Hot Working Technology
基金
国家自然科学基金资助项目(50174028)
关键词
电脉冲处理
纯铜
再结晶温度
electric pulse modification
pure copper
recrystallizing temperature