摘要
针对沟道下方开硅窗口的图形化SOI(PSOI)横向双扩散MOSFET(LDMOSFET)进行了结构优化分析,发现存在优化的漂移区长度和掺杂浓度以及顶层硅厚度使PSOILDMOSFET具有最大的击穿电压和较低的开态电阻。PSOI结构的RESURF条件为Nd·tsi=1.8~3×1012cm-2。对结构优化的PSOILDMOSFET进行了开态输出特性模拟,输出特性曲线没有曲翘现象和负导现象,开态击穿电压可达到16V,器件有源区的温度降低了50℃。结构优化有利于提高器件性能和降低器件的开发成本。
The optimization of PSOI LDMOSFET structure was achieved through numerical analysis, There existed optimal drift length, doping concentration, and top silicon thickness making the structure have high off-breakdown voltage and low on-resistance. The RESURF rule for PSOI structure was Nd·tsi=1.8~3×10^12cm^-2. The output characteristics of the optimized PSOI structure were also analyzed. No kink effect or negative conductivity effect were shown, and the device temperature decreased about 50℃. The structure optimization was a good way to improve the performance of the device and decrease the fabrication costs.
出处
《半导体技术》
CAS
CSCD
北大核心
2006年第6期444-447,459,共5页
Semiconductor Technology
基金
上海市自然科学基金(03ZR14109)资助项目