摘要
在介绍了微电子机械系统的起源和特点的基础上,对微电子机械系统的加工、封装测试、及应用进行了较全面的论述,提出和展望了其广阔的发展前景。
With a thorough description of processing , sealed testifying and application in microelectronic mechanical system on the basis of an introduction to the origin and features of microelectronic mechanical system, proposed and forecast broad developmental prospects.
关键词
微电子机械系统
微加工技术
封装技术
应用领域
Microelectronic Mechanical System
Processing Technology
Sealing Technology
Spheres of Application
