摘要
从BGA的封装形式、PCB的设计、焊膏印刷、贴片、回流焊接工艺等方面分析了BGA组装过程中应注意的问题及其预防措施。以常用的PBGA和CBGA为例,分析了两种不同封装形式BGA的结构特点和组装过程中应注意的问题,以焊膏Sn63Pb37、Sn62Pb36Ag2和Sn96.5Ag3.0Cu0.5为例,分析了传统的SnPb组装工艺和无铅组装工艺的特点,以提高BGA组装的质量。
Attention questions and measures during BGA assembly were analyzed to increase BGA assembly quality by BGA package, PCB design, solder paste print, place BGA, and reflow soldering process. As a matter of common PBGA and CBGA, different package structures of BGA and attentional problems during assembly were analyzed. And traditional SnPb assembly process and lead free assembly process were analyzed by Sn63Pb37, Sn62Pb36Ag2 and Sn96.5Ag3.0Cu0.5 pastes to increase BGA assembly quality.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2006年第6期10-12,共3页
Electronic Components And Materials
关键词
半导体技术
BGA
综述
封装
PCB
无铅
回流焊接
温度曲线
semiconductor technology
BGA
review
package
PCB
lead free
reflow soldering
temperature profile
