摘要
通过添加稀土Ce研究了Sn-3.0Ag-2.8Cu系焊料合金的显微组织和性能。用光学显微镜、SEM、EDX对其显微组织进行分析,并且对其导电性,润湿性,硬度等重要性能进行测试。结果表明,添加稀土w(Ce)为1%焊料合金的导电性明显提高;而润湿角明显减小,润湿性增强;同时焊料合金的硬度也有所增加。
The Sn-3.0Ag-2.8Cu solder of addition micro-vadable-Ce was studied. The microstructure was observed by means of optical microscopy, SEM and EDX, and some important properties as conductivity property, wetting property and rigidity were tested. The results show that conductivity property of addition ce solder alloy is enhanced obviously; the contact angle can be reduced clearly; the rigidity of solder alloy is also increased.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2006年第6期27-29,共3页
Electronic Components And Materials
基金
陕西省自然科学研究计划项目基金资助(2002E111)
关键词
金属材料
无铅焊料
稀土Ce
导电性
润湿性
metallic materials
lead-free solder
rare earth Ce
conductivity property
wetting property
