摘要
本文以BGA和PLMP两种封装为例,介绍了仙童半导体公司的新型封装。并与标准封装在电气性能和热性能方面进行了比较。同时给出了核心DC-DC变换器的设计方法,并给出了实验结果。
New generation packages of BGA and FLMP from Fairchild Semiconductor was introduced in this paper. Their electrical and thermal performance were compared with standard packages, Design approach of core DC-DC converter was also proposed, test results were given as well.
出处
《电力电子》
2006年第2期36-39,共4页
Power Electronics
关键词
封装
电气性能
热性能
DC^DC变换器
Package Eectrical performance Thermal performance DC-DC converter
