摘要
介绍了评价磷铜阳极质量的几个关键因素,即原材料纯度、晶粒结构、磷含量和表面清洁,以及它们对电镀产品质量的影响。
This paper summarizes several key factors effect the copper anode quality, they are raw material purity, grain structure, phosphorous content and cleanliness, and how they contribute to the plating quality.
出处
《印制电路信息》
2006年第6期40-43,共4页
Printed Circuit Information
关键词
磷铜阳极
晶粒结构
钝化
阳极泥
清洁度
磷含量
phosphorized copper anode grain structure passivation anodicsludge cleanliness phosphorous content
