摘要
Sn-Pb 的界面的现象在 Au/Ni/Cu 上焊接微滴填 reinvestigated。连续 AuSn_2 和像针的 AuSn_4 在液态反应以后在接口被形成(焊接) 。在 solder 和 Au 层之间的界面的反应在稳固的州的老化期间继续， AuSn_4 从接口和 felling 折断进 thes 更旧。进 solder 的 Au 层溶解和散开的动力学在焊接并且变老期间被分析阐明在 solder/Au 垫接口的金属间化合的形成机制。焊接 / 填接口附近的 Au 的 Theconcentration 被识别在液态反应的时期期间增加并且到达溶解度限制。在稳固的州的反应期间， Au-Sn 化合物变厚被元素散开主要控制。
The interracial phenomena of the Sn-Pb solder droplet on and needle-like AuSn4 are formed at the interface after Au/Ni/Cu pad are investigated. A continuous AuSn2 the liquid state reaction （soldering）. The interracial reaction between the solder and Au layer continues during solid state aging with AuSn4 breaking off from the interface and felling into the solder. The kinetics of Au layer dissolution and diffusion into the solder during soldering and aging is analyzed to elucidate intermetallic formation mechanism at the solder/Au pad interface. The concentration of Au near the solder/pad interface is identified to increase and reach the solubility limit during the period of liquid state reaction. During solid state reaction, the thickening of Au-Sn compound is mainly controlled by element diffusion.
