集成电路陶瓷外壳析出物失效模式分析

An Analysis on Failure Mode Induced by Educts from Ceramic IC Packages

为了集成电路的可靠性保证,往往需要对集成电路外壳进行验收。验收项目中,有一个耐湿试验分组,用来加速评定外壳的抗腐蚀性能及相应的质量可靠性能。在该试验分组中发现,陶瓷外壳失效除了已有的常规模式外,还有一种很严重的析出物失效模式。发现焊框与陶瓷结合处有胶体状析出物,析出物以流质状态析出,然后凝固,严重的还会造成焊框漏气,从而引起外壳失效。

In order to ensure the reliability of integrated circuits, acceptance tests are needed for IC packages. In acceptance tests, a moisture resistance test is used to evaluate the anticorrosion property of the package and its relevant quality reliability. It has been found in the moisture resistance test that, apart from the existing conventional failure modes, there is a severe failure mode, which is induced by colloid educts at the joints of soldering frame and ceramic packages. The educt is separated out in fluid form and solidified, which would cause leakage of the soldering frame, thus resulting in package failures.