虚拟SPI时序在TC77与S3C2410通信中的应用

Application of Virtual SPI Time Sequence in the Communication between TC77 and S3C2410 under Embedded Environment

嵌入式系统中,三星S3C2410处理器与数字温度传感器TC77之间的通信由于受到数据宽度的限制,采用现有接口难以实现。本文采用虚拟SPI时序实现了TC77与S3C2410的正常通信,并给出了连接图和相应的驱动程序。该方法对嵌入式系统开发中类似的问题提供了较好的解决方案。

The communication between Samsung microprocessor S3C2410 and digital temperature sensor TC77 is not easy to be implemented using the built-in interface of S3C2410 due to different data width. In this study, we develop a virtual SPI time sequence technique for implementing the communication between TC77 and S3C2410. Under careful study on TC77 data I/O time sequence, the program to simulate the time sequence was developed. Diagram of connections between certain pins of TC77 and S3C2410 were presented to show how the virtual SPI time sequence program worked. Experiment results observe a good performance of communication between digital temperature sensor and the microprocessor. The virtual SPI time sequence technique can meet the requirements of communication correctness and stability as well as the built-in interface does. The methodology provides a good reference to similar problems under embedded Linux environment.