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高速PCB板地分割引起的电磁兼容性问题分析 被引量:1

The EMC Issue Analysis Resulted from Ground Partitioning in High Speed PCB Board
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摘要 本文介绍了在高速PCB板中由于时钟信号线穿越地分割引起的电磁辐射问题并给出了解决方案,使用EMC仿真工具对其进行了仿真。并分析论证了在一定条件下EMC与环路面积、信号完整性之间的关系。 This paper analyzes the problem of radiated emission resulted from ground partitioningin high speed PCB board, end provides some solutions to solve such issues with EMC simulationtools. Also this paper explains the relations among EMC, Signal Integrity end Circle Area withtheory and experiments based on some cases.
出处 《电子质量》 2006年第6期86-89,共4页 Electronics Quality
关键词 电磁兼容 电磁辐射 地分割 信号完整性 高速PCB板 EMC Radiated Emission Ground Split Signal Integrity High Speed Board
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  • 1李富同,秦伟芳,山其贤,Wayne Hunter.高速PCB板的EMI设计导则[J].电子质量,2004(12):21-22. 被引量:5
  • 2[1]Jonas Ekman,Giulio Antonini,Antonio Orlandi.3D PEEC Capacitance Calculations //2003 IEEE Symposium on Electromagnetic Compatibility[C].Boston:IEEE,2003.
  • 3[5]Pierce A.Brennan,Norman Raver,Albert E.Ruehli.Three-Dimensional Inductance Computations with Partial Element Equivalent Circuits[J].IBM Journal of Research and development,1979,23(6):661-668.
  • 4[6]Mee.Scott Ranganathan,Sreeniwas Taylor,Robert.Effective Use of EMC Analysis Tools in the Automotive Product Development Process//2005 IEEE International Symposium on Electromagnetic Compatibility[C].Chicago:IEEE,2005.
  • 5李富华,曹毅,李征帆.基于PEEC方法的平面电路EMC问题分析[J].上海交通大学学报,2001,35(11):1607-1610. 被引量:4

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