摘要
将高阶逐层离散层板模型和均匀化理论相结合,应用于具有非完全(单层内)周期性微结构的多层结构,用解析法分析了电子封装结构中由焊点和底充胶构成的非均质夹层的等效弹性常数．计算结果与已有结果进行了比较,验证了文中分析方法的有效性和简便性．
In this paper, the homogenization theory and higher order discrete-layer laminate model are applied to the flip-chip electronic package assemblies with underfills, with microstructures not completely periodic （single layer）. The effective elastic properties for a laminar with BGA and underfills are determined by an analytic method. The numerical results are compared with the previous solutions, which shows the efficiency of the present model and method.
出处
《力学与实践》
CSCD
北大核心
2006年第3期40-42,18,共4页
Mechanics in Engineering
关键词
夹杂
焊点列阵
高阶逐层离散模型
等效弹性常数
inclusion, BGA, higher order discrete-layer model, effective elastic properties
