SiC/Al电子封装材料的制备工艺研究

Preparation technique of SiC/Al composite

对用无压浸渗法制备高体积分数的SiC／Al复合材料的浸渗过程进行了分析。结果表明：温度在900～1100℃之间变化时，随着温度的升高浸渗深度增加；充分的浸渗时间可提高界面的润湿性，促使铝合金液顺利浸渗；Mg量为10%时浸渗能顺利进行；N2作为保护气氛，不但可以防止氧化，而且可以促进铝合金液对SiC颗粒的浸渗。

An approach to pressure- free metal infiltration technology for fabricating SiC/Al composite is fund. The results indicate that parameters such as infiltration temperature and time, and the content of Mg and N2 have much effect on the fabrication process and properties of SiC/Al composite.