摘要
在分析某低压功放集成电路功能原理的基础上,针对该电路成品测试中出现的特性异常现象,结合原理分析,采用模拟仿真的方法,分析、再现异常现象,确定了导致特性异常的原因,并通过对PCM测试图形的测试,验证了分析结论。
The simulation analysis of abnormal phenomenon occured in low-voltage power amplifier IC is presented using simulation software Pspice based on analyzing the function of the IC and the operating principle of semiconductor devices. The causes of the abnormal phenomenon in the low-voltage power amplifier IC are determined and the conclusion is confirmed by testing the PCM test chip.
出处
《电子产品可靠性与环境试验》
2006年第3期16-18,共3页
Electronic Product Reliability and Environmental Testing
