期刊文献+

SiC_p/Al复合材料化学镀镍层耐蚀性能及机理研究 被引量:8

CORROSION RESISTANCE OF ELECTROLESS Ni COATINGS ON SiC_p/Al COMPOSITE AND MECHANISM
下载PDF
导出
摘要 在考察镀覆条件对镀层含磷量影响的基础上,用电化学方法评价不同含磷量镀层的耐蚀性,得到基本一致的结果:镀液温度及pH值降低,镀层磷含量升高,而镀层含磷量的提高又使镀层的耐蚀性提高.用SEM、EDAX和XRD研究了镀层的表面和断面形貌、含磷量以及相结构,探讨了碳化硅颗粒增强铝基(SiCp/Al)复合材料表面化学镀镍层耐腐蚀的机理.结果表明,在腐蚀过程中,镀层中磷元素在表面富集形成具有良好耐蚀性的钝化膜,从而提高镀层的自钝化能力和耐蚀性. Ni - P coatings were prepared on SiCp/Al composite by autocatalytic deposition and their corrosion behaviors in 3.5 96 NaCI solution at 25℃ were studied by electrochemical impedance spectroscopy and potentiodynamic techniques. SEM, EDAX and XRD were also employed to examine the coatings so as to understand the corrosion mechanism of the coatings. The plating conditions show great influences on the P content of the coatings and thus the corrosion resistance. The P content of the coatings increases with decreasing the plating temperatures and pH values. The corrosion resistance of the coating can be increased significantly by increasing the P content of the coatings, whieh is ascribed to that the existence of P can improve significantly self passivation of the coatings in the solution.
出处 《中国腐蚀与防护学报》 CAS CSCD 北大核心 2006年第3期160-165,共6页 Journal of Chinese Society For Corrosion and Protection
基金 哈尔滨工业大学跨学科交叉性研究基金资助(HIT.MD.2002.17)
关键词 镍磷合金镀层 耐蚀性能 含磷量 机理 SICP/AL复合材料 Ni - P alloy coatings, corrosion resistance, P content, mechanism, SiCp/Al composite
  • 相关文献

参考文献14

  • 1Moustafa S F,Abdel-Hamid Z,Abd-Elhay A M.Aluminum matrix SiC and Al2O3 particulate composites are manufactured by powder metallurgy technique[J].Mater.Lett.,2002,53(4-5):244-249
  • 2Kevin A M,Yogendra K J.High performance packaging materials and architectures for improved thermal management of power electronics[J].Future Circuits Int.,2001,(7):45-49
  • 3喻学斌,吴人洁,张国定.金属基电子封装复合材料的研究现状及发展[J].材料导报,1994,8(3):64-66. 被引量:57
  • 4Johnston C,Young R.Advanced thermal management materials[J].Int.New Microsyst MEMs,2000,2(1):14-15
  • 5Zhang Q,Xiu Z Y,Song M H,et al.Microstructure and properties of a 70vol.% SiCp/Al-12Si composite for electronic packaging[J].Materials Science Forum,2005,475-479:881-884
  • 6Kong F Z,Zhang X B,Xiong W Q.Continuous Ni-layer on multiwall carbon nanotubes by an electroless plating method[J].Surf.Coat.Technol.,2002,155(1):33-36
  • 7Huang C Y,Mo W W.The effect of attached fragments on dense layer of electroless NiyP deposition on the electromagnetic interference shielding effectiveness of carbon fibreyacrylonitrile-butadiene-styrene composites[J].Surf.Coat.Technol.,2002,154(1):55-62
  • 8张邦维,谢浩文.化学镀制备Ni-Sn-Cu-P合金非晶形成能力[J].稀有金属材料与工程,1998,27(2):79-83. 被引量:4
  • 9刘新宽,向阳辉,胡文彬,丁文江.镁合金化学镀镍层的结合机理[J].中国腐蚀与防护学报,2002,22(4):233-236. 被引量:34
  • 10李淑华,李宝彦,张久龙.化学沉积镍磷非晶态合金沉积过程及耐蚀性的研究[J].材料科学与工艺,1994,2(1):39-43. 被引量:3

二级参考文献27

共引文献103

同被引文献62

引证文献8

二级引证文献42

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部