电子封装中的铝碳化硅及其应用

AlSiC Metal Matrix Composites and Its Application in Microelectronics Packaging

随着电子封装技术的迅速发展,铝碳化硅AlSiC金属基复合材料成为高新封装技术的热门话题之一。AlSiC在电子封装中优势凸现,文章主要介绍AlSiC的性能特点、类型、制备方法以及在电子封装中的应用,并展望了这类封装材料的发展趋势。

With the rapid development of microelectronics packaging, A1SiC metal matrix composites becomes the issue of advanced packaging materials for one. AlSiC have more obvious advantages than other materials. The characteristic, types, preparation methods and applications. Of AlSiC in microelectronics packaging are presented. The developing trends of these materials are also discussed.