摘要
随着电子封装技术的迅速发展,铝碳化硅AlSiC金属基复合材料成为高新封装技术的热门话题之一。AlSiC在电子封装中优势凸现,文章主要介绍AlSiC的性能特点、类型、制备方法以及在电子封装中的应用,并展望了这类封装材料的发展趋势。
With the rapid development of microelectronics packaging, A1SiC metal matrix composites becomes the issue of advanced packaging materials for one. AlSiC have more obvious advantages than other materials. The characteristic, types, preparation methods and applications. Of AlSiC in microelectronics packaging are presented. The developing trends of these materials are also discussed.
出处
《电子与封装》
2006年第6期16-20,共5页
Electronics & Packaging
关键词
复合材料
电子封装
铝碳化硅
Metal Mateix Composites
Microelectronics Packaging
A1SiC