铜离子-铜铁试剂络合物在碳糊电极上的吸附伏安行为

Study on the Adsorptive-voltammetric Behavior of the Complex of Copper and Cps at Paste Carbon Electrode

研究了铜铁试剂与铜的络合物在碳糊电极上的电化学行为，在pH=4.1的B-R缓冲溶液介质中，铜铁试剂与铜离子络合物关阶微分还原峰电位为-0.75V（va.SCE）,共峰电流与铜离子的浓度在5.0×10^-7-2.0×10^-5mol/L范围内成良好的线性，r=0.9957；检测限为1.1×10^-7mol/L，用该法测定了米粉中铜含量。

A sensitive half- order derivative of adsorpitive - reduction peak produced by the complex of Cu（ H ） - Cpf at paste carbon electrode in B - R buffer solution（ pH = 4. 1 ） was observed at 0.75 V（ vs. SCE） .The peak current of half- order derivative was in linear relationship with the concentration of Cu（ Ⅱ ） in the range of 5.0 × 10^-7 - 2.0 × 10^-5 mol/L,The linear equuation was ip （mA/s^1/2 ） = 0.406 8 ＋ 0.003 14 × 107 c , Detection limit of the method was 1. 1 × 10^-7 mol/L, and the meebenism of the electrode rection was diseassed. The method has been applied satisfaetorily tu the determination of trace amounts of copper in flee flour.