氮化铝陶瓷与铜界面传热计算机仿真

The Computer Simulation of Heat Transfer Process Between AlN Ceramic and Copper

固体界面热阻是航空航天、低温与超导、微电子技术等领域中研究热点问题,氮化铝陶瓷和金属铜被广泛应用于低温超导装置和集成电路芯片。基于氮化铝陶瓷与金属铜样品之间界面热阻的低温实验,应用MATLAB软件对实验数据进行回归分析,建立了氮化铝陶瓷与铜之间界面热阻与温度、压力等参数的回归分析仿真模型,仿真结果与实验数据有较好的一致性。研究结果对氮化铝陶瓷、铜应用于超导装置和集成电路芯片的传热设计、空间热控制具有重要意义。

The interface thermal resistance was the basic science problem in the fields of cryogenics, aerospace, superconducting and microelectronic technology etc. The AIN（ceramic material） and Copper have been widely used in the cryogenic superconducting devices and integrated circuit chips. Based on the low temperature experiment of interface thermal resistance between AIN ceramic and copper, the simulation model of interface thermal resistance between AIN and copper has been built according to the regression analyses by applying Matlab software. The simulation results were reasonable agreement with the cryogenic experiment data of interface thermal resistance. The investigation results were significant for the aerospace thermal control, design of heat transfer of the AIN ceramic and Cu in the application of the cryogenic superconducting devices and integrated circuit chips.