金刚石车削单晶锗和硅

Diamond Turning of Single Crystal Germanium and Silicon

本文研究了金刚石车削单晶锗、硅时表面粗糙度随切削方向的变化规律。研究表明：表面粗糙度与切削方向和解理面的夹角有关，夹角越大，切削力在垂直于解理面方向上的分力越大，材料越倾向于产生解理破坏，表面粗糙度越大；反之，材料越倾向于滑移变形。

The variable regularity of surface roughness on diamond turned single crystal germanium and silicon was investigated in this paper.The surface roughness relates to the angles between cutting direction and cleavage planes,the bigger becomes the angle,the bigger becomes the cutting force component perpenticular to the cleavage plane,the more brittle cleavage fracture may tend to occur for materrial removal.Consequently,the surface roughness becomes larger.Otherwise,the smaller becomes the angle,the more plastic deformation may tend to occur for material removal,the surface roughness becomes smaller.