摘要
介绍了一种用于热风整平、回流焊、波峰焊以及金手指和印制板部分的保护层———可剥蓝胶,并详细介绍了其制作工艺过程。另外,还与高温胶带在使用和成本上作了一个比较。
One protection layer which used in HASL, wave soldering, golden fingers, reflow soldering and part of PCB is introduced by this article. It also particular introduces its fabrication process. Except that, it compact the use and cost with high termperature adhesives.
出处
《舰船电子工程》
2006年第3期181-182,共2页
Ship Electronic Engineering
关键词
可剥蓝胶
剥离
热固化
高温胶带
peelable solder mask ink, peel off, heat cured, high termperture adhesives
