摘要
低温烧结、低介电常数和低介质损耗的陶瓷材料是影响叠层片式电感发展的关键因素之一。文章综述了高频MLCI低介电常数陶瓷材料的最新研究,重点介绍了玻璃-陶瓷复合体系和微晶玻璃体系的材料研究进展,并简述了MLCI低温烧结方法和发展趋势。
Low-dielectric, low-temperature sintering ceramic is one of key influencing factors of Multilayer Chip Inductors （MLCI） development. This paper reviews recent studies conducted on the ceramic materials for high frequency MLCI.The research progress on the ceramic-filled glass and crystallizable glass system materials is particularly introduced. While low sintering methods and developingtendence of MLCI are summarized.
出处
《绝缘材料》
CAS
2006年第3期23-26,共4页
Insulating Materials
关键词
叠层片式电感
低介电常数
低温烧结
陶瓷材料
multilayer chip inductors
low-dielectric
low-temperature sintering
ceramic material
