摘要
研究了酞侧基聚芳醚酮（ＰＥＫ－Ｃ）的屈服应力、杨氏模量和断裂韧性等对温度的依赖性，给出了本文所用ＰＥＫ－Ｃ的屈服应力与杨氏模量及屈服应力与断裂韧性间的定量关系．研究表明，在１２℃～１９０℃的温度范围内，随温度的升高，材料的屈服应力、杨氏模量降低．断裂韧性Ｋ１ｃ和Ｇ１ｃ的对数与屈服应力间存在很好的线性关系．
emperature dependence of yield stress, Young ' s modulus and fracture toughness of phenolphthalein polyether ketone (PEK-C) were investigated. It wasconcluded that the yield stress, Young's modulus decreased with increasing temperaturefor the period from 12 ℃ to 190 ℃. The quantitative relationships between theyield stress, the Young's modulus and the fracture toughness were given' Thereexhibit good linear relationships between Log Klc, Lag GIc and yield stress forPSa - C.
出处
《高分子学报》
SCIE
CAS
CSCD
北大核心
1996年第4期429-433,共5页
Acta Polymerica Sinica
基金
国家自然科学基金
