脉冲射流电铸纳米晶铜的组织与性能

Microstructure and Properties of Nanocrystalline Copper Prepared by Jet Electroforming with Pulse-current

采用射流电铸快速成型方法,在脉冲电流条件下制备了铜铸层,研究了脉冲电流频率和峰值电流密度对铜铸层表面形貌、微观组织结构、晶粒大小以及力学性能的影响。结果表明：在高电流密度下制备出的块体纳米晶铜,晶粒尺寸为32～65nm；提高脉冲电流频率和峰值电流密度有利于获得颗粒细小、表面平整的纳米晶铜铸层；制备的纳米晶铜最大抗拉强度高达590 MPa,是普通粗晶铜的4．5倍,纳米晶铜的最大伸长率为10％。

The method of rapid prototyping oriented by jet electroforming has been used to prepare bulk nanocrystalline copper under the condition of pulse current. The effects of pulse current frequencies and peak current densities on the surface morphology, microstructure, grain sizes and mechanical properties of the copper deposits have been studied. Bulk nanocrystalline coppers with grain sizes in the range of 32-65 nm could be fabricated under the condition of high current density. The deposits of copper with fine grain sizes and smooth surfaces could be got by increasing pulse current frequency and current density. The maximum tensile strength of the nanocrystalline copper reached to 590 MPa, about 4. 5 times of the one of the coarse crystalline copper. The maximum tensile elongation of the nanocrystalline copper reached 10%.