电铸自支撑金刚石-镍复合膜的制备(英文)

Preparation of Free-standing Diamond Grains-nickel Composite Film by Electrotyping

用电铸方法，采用低应力电镀液，制备出了自支撑金刚石-镍复合膜。电镀液PH值3．84．2，温度40～60℃，阳极与阴极间距100～150mm。用扫描电镜（SEM）和X射线衍射（XRD）方法检测了复合膜的表面形貌、晶体显微结构和复合膜中金刚石颗粒的分布情况。结果表明：阴极电流密度对自支撑金刚石-镍复合膜的品质影响很大，当阴极电流密度从1．3A／dm^2增加到3．3A／dm^3时，复合膜的显微应变从0．36％减小到0．28％；随着阴极电流密度的增加，复合膜中金刚石颗粒的含量增加。

Free-standing diamond grain-nickel composite films were deposited by electrotyping method at the condition of low internal stress electrolytic solution, with pH value of 3.8-4.2, temperature of 40-60℃, the distance of 100-150mm between the cathode and anode. Scanning electron microscope （SEM） and X- ray diffraction （XRD） were used to measure the surface morphology, the crystal microstructure and the distribution of diamond grain in the film. It was found that the electric current density of cathode strongly affected the quality of diamond grain-nickel composite film. The micro-strain in the film decreased from 0.36% to 0. 28% by increasing of the electric current density from 1.3 A/dm^2 to 3.3 A/dm^2 ; and the content of diamond grains in the film increased with the increase of current density.