银基钎料钎焊金刚石的界面结构及TiC生长机制

Thermodynamic Studies on Interfacial Reactions between Diamond and Ag-base filler

在合适的工艺下,采用Ag-Cu-Ti钎料实现了金刚石与钢基体的高强度连接,并剖析了Ag-Cu-Ti钎料与金刚石的界面微区结构。通过对界面处的成分分布和深腐蚀后碳化物TiC形貌的观察,分析了Ti的作用机理、新生化合物TiC的形貌及生长规律。结果表明:在一定的条件下,Ti元素与组成金刚石的碳元素发生反应形成TiC层;碳化物层使钎料与金刚石之间产生冶金结合,并在其界面上形成了金刚石/TiC/钎料/钢基体的梯度结合层。

A firm joint between steel base and diamond grain was realized by using brazing technique.Discuss forming mechanism of carbide layer between fillers and diamond surface.The distribution of composition and TiC morphologies in the interface were analyzed.The behaviour mechanism of Ti and the growth mode of TiC were investigated.Results showed that the Ag-Cu-Ti fillers reacted with C in the diamond surface to form carbide layer,soon after the Ag-Cu-Ti alloys was melted.The carbide layer is formed as a result of the reaction between Ti and diamond.As a result,metallurgical bonding is produced between filler metal and diamond through the forming the TiC between the interface of diamond and filler metal.